heat sink resistance

with Heat Sink The overall thermal resistance R JA through the top of the device can be calculated as described in Equation 2. The junction-to-case thermal resistance R JC is a property of the MOSFET, the case-to-heat sink thermal resistance R CS is the resistance of the interface material and R SA is the thermal resistance between the heat ... The image below (not an L298) illustrates the different sources of thermal resistance with a heat sink assembly. We can see that the heat will have to transfer through the case, thermal compound, or adhesive (indicated by the blue dashed

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